新产品简介-加强型焊柱Cu-CCGA

 

    加强型锡柱是在普通锡柱的基础上演变而来。通过在普通焊线上绕一定规格的铜线，然后在进行电镀Sn63/Pb37合金形成良好的外观。加强型焊柱具有比普通焊锡柱更好的热循环性能，同时在CCGA封装时，Sn20/Pb80（固相点183℃，液相点280℃）合金具有更好的回流焊窗口。

      Copper wrap solder columns based on the plain solder columns are an advnced development.we will wind a certain size copper wires or copper foils around the core solder wire, then The hot solder coating(Sn63/Pb37 eutectic alloy) is appendedCompared with traditional plain solder columns,copper wrap solder columns have better thermal cycling ability, and Sn20/Pb80 alloy (The solidus temperature, 183℃, the liquidus temperature, 280℃) makes it more suitable for reflow soldering window.